Services: Development

PCB Design and Layout

High Power, High Speed, Manufacturability ​& Regulatory

As part of a larger turnkey product development, or if you have a completed the schematic and just need a board designer to complete the layout, Au-Zone has the tools and expertise in house to complete your PCB design efficiently and predictably.   These service engagements typical scale from assisting your in-house resource with a review or particularly complex layout all the way up to completing the entire PCB design including enclosure design.  Having completed numerous designs from simple 2 layer boards to complex, multi-board designs using advanced technologies and substrates, we’re comfortable quoting and delivering on both ends of the spectrum.  The list below provides a high level overview of the scope and scale of our layout capabilities.

eCAD / mCAD Tools

  • Altium Designer
  • SolidWorks
  • PADS PowerPCB
  • OrCAD (schematic capture)

Mechanical Features and Packaging

mechanical integration

  • Integrated electro-mechanical design process
  • 3D modelling of board outlines and components
  • Complex multiboard assemblies and custom interfaces/cables
  • Advanced / complex floor planning and component placements
  • Full integration with custom enclosures and complex packaging designs
  • Integrations with ancillary elements - light pipes, keypads, LCD's, modules

Routing Experience

  • Multilater boards upto 14 layers
  • Mixed / Multiplane designs
  • Complex SoC's and high density breakouts (blind & buried vias)
  • High voltage, custom power supplies
  • Safety critical with strict creepage & clearance requirements

high density BGA layout

High Speed Digital Interfaces

  • DDR3 memory interfaces upto 1.6Ghz
  • High speed SerDes
  • MIPI CSI-2, 3
  • USB 3.0
  • PCI Express
  • SATA
  • Ethernet, GIGe and POE

Analog & RF Layouts and Integrations

  • Low noise Analog to Digital front ends
  • Antenna matching circuits
  • RF amplifiers, multiplexors and switches
  • GPS, Bluetooth, 802.11a/b/g/n, Zigbee, Iridium

Timing & Signal Integrity Simulations

  • Signal Crosstalk
  • Signal integrity analysis
  • Matched impedance

Standard and Specialized Substrates

  • Standard FR4 and high temp FR4
  • Low loss RF laminates
  • Mixed RF/FR4 laminates
  • Multi-layer flex
  • Rigid flex

Manufacturability Considerations

  • RoHS compliance
  • Standard leadfree and leaded processes
  • Design For Manufacturing (DFM) optimization
  • Design For Test (DFT) optimization

Associated Projects:


Contact us today for a free 30 minute consultation to discuss how Au-Zone's Design Services and Imaging Solutions can help you save time and money on your next project.